Carbon‐Nanotube Through‐Silicon Via Interconnects for Three‐Dimensional Integration

• DOI: 10.1002/smll.201100615
• Publication Date: 2011-06-21T09:57:45Z
• Authors: Teng Wang; Kejll Jeppson; Lilei Ye; Johan Liu
• Keywords: Microscale chemistry; Electrical contacts

Interconnection of carbon-nanotube (CNT)-filled through-silicon vias is demonstrated through an easy-to-implement process based on mechanical fastening. Direct CNT-to-CNT and CNT-to-Au contacts are realized at the microscale, their specific contact resistances extracted from electrical measurements approximately 1.2 × 10−3 Ω cm2 4.5 10−4 cm2, respectively. Detailed facts importance to specialist readers published as "Supporting Information". Such documents peer-reviewed, but not copy-edited or typeset. They made available submitted by authors. Please note: The publisher responsible for content functionality any supporting information supplied Any queries (other than missing content) should be directed corresponding author article.