Reliable response of RF MEMS LTCC packaged switches after mechanical and thermal stress

• DOI: 10.1007/s00542-015-2577-5
• Publication Date: 2015-05-22T10:20:04Z
• Authors: A. Lucibello; G. Capoccia; E. Proietti; R. Marcelli; B. Margesin; V. Mulloni; F. Giacomozzi; F. Vitulli; M. Scipioni; G. Bartolucci
• Keywords: reliability; redundancy; LTCC; 621; space components; Switch; RF MEMS; Reliability; 01 natural sciences; redundancy; reliability; RF MEMS; space components; packaged switches; 620; MEMS; 0103 physical sciences; Settore ING-INF/01 - ELETTRONICA; RF

Space components need a ground characterization based on several solicitations, including mechanical and thermal stress, before their final qualification. In this paper, RF MEMS switches designed for redundancy logic have been extensively measured with promising results in terms of thermal and mechanical cycles. Packaging contributions have also been discussed.