Bismaleimide/epoxy/aromatic diamine ternary resin molding compounds for high-temperature electronic packaging applications
DOI:
10.1007/s10853-025-10595-1
Publication Date:
2025-01-09T18:36:03Z
AUTHORS (8)
ABSTRACT
SUPPLEMENTAL MATERIAL
Coming soon ....
REFERENCES (37)
CITATIONS (0)
EXTERNAL LINKS
PlumX Metrics
RECOMMENDATIONS
FAIR ASSESSMENT
Coming soon ....
JUPYTER LAB
Coming soon ....