Processing and creep properties of Sn-Cu composite solders with small amounts of nanosized Ag reinforcement additions

• DOI: 10.1007/s11664-005-0190-6
• Publication Date: 2007-04-06T08:15:19Z
• Authors: F. Tai; F. Guo; Z. D. Xia; Y. P. Lei; Y. F. Yan; J. P. Liu; Y. W. Shi
• Keywords: 0103 physical sciences; 01 natural sciences

In this research, nanosized Ag reinforcement particles were incorporated by mechanical means into a promising lead-free solder, Sn-0.7Cu, in an effort to improve the comprehensive property of the Sn-0.7Cu solder. Wettability, mechanical performance, and creep-rupture life tests were conducted to study the difference between Sn-0.7Cu solder and its composite solder with different Ag reinforcement volume fractions. Experimental results indicated that the composite solders and their joints showed better wettability and mechanical properties, as well as longer creep-rupture lives, than Sn-0.7Cu solder. The composite solder with 1vol.%Ag reinforcement addition exhibited the best comprehensive property as compared to the composite solders with other reinforcement volume fractions. Systematic creep-rupture life tests were conducted on the 1vol.%Ag-reinforced Sn-0.7Cu-based composite solder joints. Significant enhancement of the creep-rupture lives were found in the composite solder joints under different stress and temperature combinations as compared to the Sn-0.7Cu solder joint. Ductile rupture surfaces were exhibited in most of the broken solder joints.