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Review on Shear Strength and Reliability of Nanoparticle Sintered Joints for Power Electronics Packaging

Electronic Packaging Power Electronics Shear Strength Solid-state physics
DOI: 10.1007/s11664-024-10970-9 Publication Date: 2024-03-29T12:02:41Z
Abstract Supplemental Material References Cited by
AUTHORS (7)
Ze Cui
Qiang Jia
Hongqiang Zhang
Yishu Wang
Limin Ma
Guisheng Zou
Fu Guo
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