Shear strength of copper joints prepared by low temperature sintering of silver nanoparticles

• DOI: 10.1007/s13391-013-3148-5
• Publication Date: 2014-01-27T05:28:33Z
• Authors: Zbyněk Pešina; Vít Vykoukal; Marián Palcut; Jiří Sopoušek
• Keywords: Ag; Cu; pevnost ve smyku; zkouška; nanočástice;; Ag; Cu; shear strength; test; nanoparticle;; 02 engineering and technology; 0210 nano-technology

In this work, mechanical properties of Cu-to-Cu joint samples prepared by low temperature sintering of Ag nanoparticle paste have been investigated. The silver nanopaste was prepared by a controlled thermal decomposition of an organometallic precursor. The as-synthesized Ag particles were spherical, with an average diameter of 8.5 nm. The Cu-to-Cu joint samples were made by placing a small amount of Ag nanopaste between two polished Cu plates and sintering at 150°C, 200°C, 220°C and 350°C in air. A normal load was applied to aid sintering. Mechanical properties were measured by imposing a uniform stress across the sample bond area and measuring the corresponding strain. The application of external load was found to have a positive effect on the material’s mechanical properties. Furthermore, interestingly high values of shear strength were observed.