High-strength and high-conductivity additively manufactured Cu-O alloy enabled by cellular microstructure

• DOI: 10.1016/j.addma.2024.104244
• Publication Date: 2024-06-04T07:10:20Z
• Authors: Qi Liu; Chuanxi Ren; Zizheng Song; Xingdong Dan; Jiang Ju; Tao Yang; Song Ni; Jing Lu; Lin Liu; Jie Pan; Zibin Chen
• Keywords: Laser powder bed fusion; Electrical conductivity; Cellular microstructure; Cu alloy; Mechanical property

202406 bcch ; RGC ; Published ; 24 months ; Green (AAM)