A novel method for improving the adhesion strength of the electrodeposited Ni films in MEMS

• DOI: 10.1016/j.apsusc.2010.09.073
• Publication Date: 2010-09-30T05:01:38Z
• Authors: Hong Wang; Rui Liu; Wei Qiao Jiang; Jun Zhu; Jian Zhi Feng; Gui Fu Ding; Xiaolin Zhao
• Keywords: Plating (geology)

Adhesion performance of MEMS materials is increasingly important with the widely use of miniaturized devices. This paper proposed a novel method for improving adhesion performance between electrodeposited Ni multi-layers. The new method is to treat the Ni substrate in nickel chloride plating solution by pulse reverse current technique before electrodeposition. The dense oxide film of Ni substrate can be removed effectively by this electrochemical method, meanwhile, the proper roughness of Ni substrate is in favor of epitaxial growth during electrodeposition. Moreover, the Ni film is electrodeposited by the new method with low stress and coarse crystal grain. Consequently, the adhesion performance of Ni films is improved dramatically. The experimental results show that the adhesion performance of Ni film electrodeposited by the new method is about 3 times that of by traditional method.