Significant improvement of machinability of Cf/SiC composites through matching laser scanning spacing and abrasive belt grain size

• DOI: 10.1016/j.cja.2024.04.003
• Publication Date: 2024-04-05T22:56:28Z
• Authors: Guijian XIAO; Zhengyu YANG; Kun ZHOU; Yi HE; Xin LI
• Keywords: Machinability

To improve the application and service of Cf/SiC composites as advanced high-temperature structural materials, it is critical to achieve their high-efficiency low-damage machining. In this study, laser-ablating assisted grinding (LAAG) method was presented, connection damage behavior removal mechanism with laser processes revealed. The results demonstrated that surface after ablation covered a substantial number loose oxides primarily composed SiO2. Laser ablating process, parameter abrasive belt selection have significant impact on machining results. By fabricating an ablative layer small scanning spacing, selecting grains feed rate during grinding, machinability improved relatively lower-damage could be obtained. Under optimal combination process parameters, force temperature LAAG reduced by up 85% 35%, respectively. case, subsurface occurred only in form microcracks rather large-scale fracture, formation interface debonding matrix cracking significantly reduced. Furthermore, chips were mostly shown micron-sized powders, indicating micro-fractured attrition wear laser-ablated layer.