“White graphene” – hexagonal boron nitride based polymeric composites and their application in thermal management

• DOI: 10.1016/j.coco.2016.10.002
• Publication Date: 2016-11-09T17:19:25Z
• Authors: Haoming Fang; Shu-Lin Bai; Ching Ping Wong
• Keywords: Microelectronics; Hexagonal boron nitride; Thermal transfer

Abstract Thermal management is more and more crucial in advanced electronic devices with increasing power density. So, the demand for the materials with high thermal conductivity is rising. Hexagonal boron nitride (h-BN), called as “white graphene”, has high thermal conductivity of ~2000 W m −1 K −1 (by theoretical calculation) and is an electrical insulator, so h-BN filled polymer composite becomes a good candidate for potential employment in heat management of microelectronic devices. This paper gives a brief review on the development of h-BN based polymeric composites, including thermal transfer mechanism, fundamental design principle and application, as well as perspectives.