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Mechanically robust porous polyimide films for piezoelectric sensing at extreme condition

DOI: 10.1016/j.compscitech.2024.111006 Publication Date: 2024-12-08T06:31:08Z
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AUTHORS (8)
Pengfei He
Jianwei Li
Bilin Zhang
Liangkang Huang
Yuanyuan Zhong
Shengping Li
Wei Fan
Fei Liu
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