Experimental analysis of pinholes on electrolytic copper foil and their prevention

• DOI: 10.1016/j.engfailanal.2012.02.007
• Publication Date: 2012-03-16T15:11:32Z
• Authors: Guangbin Yi; Fenmin Cai; Wenyi Peng; Tian He; Xiangjie Yang; Yongfa Huang; Zhibin Yuan; Ping Wang
• Keywords: Pinhole (optics); Copper plating

Abstract Pinholes are a major defect in copper foils. They greatly affect both the mechanical performance and the physical properties of these foils. It was deduced that pinholes were formed due to the lead anode dissolving in the CuSO 4 –H 2 SO 4 electrolyte solution. In this paper, the copper foil samples were electrodeposited on a titanium cathode with a lead anode in a CuSO 4 –H 2 SO 4 electrolyte system with varying concentrations of non-dissolved-state lead sulphate (PbSO 4 ) and hydroxyethyl cellulose (HEC) as additives, and all other electro-deposition parameters were in accordance with the conditions observed in a manufacturing line. The results show that the PbSO 4 in the electrolyte solution is the main cause leading to pinhole formation in the copper foils. The addition of HEC to the electrolyte solution can help prevent the formation of pinholes and promote fine crystallisation, improving the mechanical properties of the copper foil.