Remarkable enhancement of thermal stability of epoxy resin through the incorporation of mesoporous silica micro-filler

Thermal Stability Diglycidyl ether Thermogravimetric analysis Sonication Filler (materials)
DOI: 10.1016/j.heliyon.2021.e05959 Publication Date: 2021-01-19T04:18:46Z
ABSTRACT
For the first time, we incorporated mesoporous micro-silica (5 μm, pore size = 50 nm) as a filler in epoxy resin aiming to enter polymer into of silica. As expected, thermal stability composite increased remarkably, followed by noteworthy degradation kinetics when compared controlled cured resin. Composites were prepared direct dispersion modified nano-silica, micro-silica, unmodified non-porous and irregular various sizes fillers diglycidyl ether bisphenol-A via ultra-sonication shear mixing, oven-curing with 4,4-diaminodiphenyl sulfone. DSC TGA analyses demonstrated higher glass transition temperature (increased 3.65–5.75 °C) very high activation energy for (average increase 46.2%) was obtained same silica pure epoxy, respectively.
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