Microstructure and morphology of the soldering interface of Sn–2.0Ag–1.5Zn low Ag content lead-free solder ball and different substrates

• DOI: 10.1016/j.heliyon.2023.e12952
• Publication Date: 2023-01-13T18:26:58Z
• Authors: Jin Xiao; Xing Tong; Jinhui Liang; Quankun Chen; Qiming Tang
• Keywords: Morphology; Ball (mathematics)

Eutectic Sn-Ag-Cu lead-free solder has limited applications due to cost and reliability issues. Sn-Ag-Zn the advantages of low melting point, good mechanical properties reliable welding interface. However, research system silver content is incomplete. In this paper, Sn-2.0Ag-1.5Zn alloy soldered different substrates. The interfacial reaction after soldering microstructure under aging treatment conditions are studied. made into balls by direct method. placed in a strength tester be heated welded substrate, then joints heating furnace for treatment. results show that bare Cu dense double-layer Intermetallic Compound (IMC) structure Cu5Zn8 Ag3Sn formed at interface blocks each other, limiting development copper-tin IMCs. with substrate electroplated Ni barrier layer, forms thin layer Ni3Sn4 metal compound. After 1000 h, thickness about 1 μm, kept 2-3 effect stable. excellent loss performance long It heat-resistance treatment, quality connection, high less environmental pollution. significant reduction. Coarse IMC not easily formed. optimized ratio Ag Zn improves toughness joint. been improved, it very promising solder.