Double-lap adhesive bonded-joints assemblies modeling

• DOI: 10.1016/j.ijadhadh.2010.02.006
• Publication Date: 2010-03-18T04:24:50Z
• Authors: O. Nemeş; F. Lachaud
• Keywords: 02 engineering and technology; 0210 nano-technology

Abstract This work presents a refined model of the stress distribution in double-lap joint assemblies. We defined all the components of the stress field function of the axial stress σxx(1) (x, y) in the first substrate and then we introduced these components into the potential energy formulation. A variational method applied to the potential energy of deformation was used and after we solved the differential equation to obtain the minimum of this energy. This model can predict very well the intensity and stress distributions in the double-lap adhesive joint assemblies. Finally, the analytical model is numerically and experimentally validated.