Enhanced thermal conductivity of liquid metal composite with lower surface tension as thermal interface materials

• DOI: 10.1016/j.jmrt.2023.04.006
• Publication Date: 2023-04-06T06:38:33Z
• Authors: Tianming Jiao; Qibo Deng; Guoxi Jing; Lijuan Zhao; Bing Han; Zhenjiao Zhang; Zhaoqiang Li; Yunfeng Zhao
• Keywords: Thermal shock; Thermal grease

Gallium (Ga)-based liquid metal (LM) has attracted great interest for thermal management due to its high conductivity (Tc). However, the surface tension of LM is too wet heat source and sink, there are risks a short circuit devices caused by leakage. The also makes it difficult well mix fillers prepare composite paste interface application. We found that contact angle on Boron nitride (BN) pill could decreased from 133° 105° doping tungsten (W) nanoparticles indicating be W nanoparticles. adding sequence LM, BN were affect final form composite, (LM+W-BN) can only obtained mixing with first (LM + W). As contrast, other sequences or without obtain powder. LM+W-BN exhibits Tc 14.49 m−1 K−1, stability under pressure, high-temperature, shock humidity was investigated in detail. shows an excellent ability as TIM application light emitting diode (LED) module. This approach been extended conductive including carbon fiber graphene. work offers simple lower might enable incorporation fillers, expanding use such integrated circuits flexible electronics.