Intermetallic compounds growth and morphology evolution of Al6061/SS304 electromagnetic pulse welding joint interface during post-weld heat treatment

• DOI: 10.1016/j.jmrt.2023.12.282
• Publication Date: 2024-01-04T11:33:20Z
• Authors: Liping Zhang; Jinpeng Wen; Jilin Xie; Yi Gou; Hehe Zhang; Yuhua Chen; Limeng Yin; Long Zhang; Lei Gao; Gang Wang
• Keywords: Crest

The effects of heat treatment on the intermetallic compounds (IMCs) and morphology at interface stainless steel 304 bonded to aluminum 6061 by electromagnetic pulse welding (EMPW) were investigated in this study. A thin discontinuous non-uniform wavy transition layer with an average thickness 1.144 μm was formed as-welded joint. After treatment, grain size Al/SS304 grew from 6.85 7.42 μm. increased significantly, reaching 4.109 after heating 210 °C for 4 h. In addition, gradually became smooth increasing temperature, suggesting growth rate IMCs trough greater than that adjacent crest. Then effect time studied. According characteristics diffusion law, faster crest layer. Differences element concentration, crystal deformation, boundaries, dislocation density, energy storage observed as a result different rates IMCs.