Spreading of high-speed tin droplets on copper substrate surfaces with ultrasonic vibration: Experiments and modeling
Sonication
Deposition
DOI:
10.1016/j.matchemphys.2023.128295
Publication Date:
2023-08-04T13:06:32Z
AUTHORS (5)
ABSTRACT
SUPPLEMENTAL MATERIAL
Coming soon ....
REFERENCES (31)
CITATIONS (2)
EXTERNAL LINKS
PlumX Metrics
RECOMMENDATIONS
FAIR ASSESSMENT
Coming soon ....
JUPYTER LAB
Coming soon ....