Advanced methods for mechanical and structural characterization of nanoscale materials for 3D IC integration

• DOI: 10.1016/j.microrel.2014.07.124
• Publication Date: 2014-08-15T17:12:21Z
• Authors: C. Sander; Y. Standke; S. Niese; R. Rosenkranz; A. Clausner; M. Gall; E. Zschech
• Keywords: 0209 industrial biotechnology; 02 engineering and technology

Abstract Managing the emerging internal mechanical stress in chips, particularly if they are 3D stacked, is a key task to maintain performance and reliability of microelectronic products. Hence, a strong need of a physics-based simulation methodology emerges. This physics-based simulation, however, requires material parameters with high accuracy. A full-chip analysis can then be performed, balancing the need for local resolution and computing time. The key for an efficient simulation of a 3D stacked IC is a comprehensive database with material properties for multiple scales of the affected materials. Therefore, effective “composite-type” material data for several regions of interest are needed. Advanced techniques to measure FEA- and design-relevant properties such as adhesion properties and effective CTE values are presented.