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Degradation mechanisms-based reliability modeling for metallized film capacitors under temperature and voltage stresses

Degradation Dielectric strength
DOI: 10.1016/j.microrel.2022.114609 Publication Date: 2022-09-25T12:59:44Z
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AUTHORS (5)
Yifan Hu
Xuerong Ye
Bokai Zheng
Zichuan Zhao
Guofu Zhai
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