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Optimization of Cu protrusion of wafer-to-wafer hybrid bonding for HBM packages application

0103 physical sciences 01 natural sciences
DOI: 10.1016/j.mssp.2022.107063 Publication Date: 2022-08-26T17:23:36Z
Abstract Supplemental Material References Cited by
AUTHORS (8)
Shizhao Wang
Hehui Zhang
Zhiqiang Tian
Tianjian Liu
Yameng Sun
Yuexin Zhang
Fang Dong
Sheng Liu
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