Review on polymer composites with high thermal conductivity and low dielectric properties for electronic packaging

• DOI: 10.1016/j.mtphys.2021.100594
• Publication Date: 2021-12-21T12:32:47Z
• Authors: R. Li; X. Yang; J. Li; Y. Shen; L. Zhang; R. Lu; C. Wang; X. Zheng; H. Chen; T. Zhang
• Keywords: Microelectronics; Electronic Packaging