The MAPS foil

• DOI: 10.1016/j.nima.2022.167673
• Publication Date: 2022-10-27T06:17:17Z
• Authors: S. Beolé; F. Carnesecchi; G. Contin; R. de Oliveira; A. di Mauro; S. Ferry; H. Hillemanns; A. Junique; A. Kluge; L. Lautner; M. Mager; B. Mehl; K. Rebane; F. Reidt; I. Sanna; M. Šuljić; A. Yüncü
• Keywords: Physics - Instrumentation and Detectors; Monolithic active pixel sensor; Monolithic active pixel sensors; Solid state detectors; 0103 physical sciences; FOS: Physical sciences; Instrumentation and Detectors (physics.ins-det); Solid state detectors; 01 natural sciences

We present a method of embedding a Monolithic Active Pixel Sensor (MAPS) into a flexible printed circuit board (FPC) and its interconnection by means of through-hole copper plating. The resulting assembly, baptised "MAPS foil", is a flexible, light, protected, and fully integrated detector module. By using widely available printed circuit board manufacturing techniques, the production of these devices can be scaled easily in size and volume, making it a compelling candidate for future large-scale applications. A first series of prototypes that embed the ALPIDE chip has been produced, functionally tested, and shown to be working.