A design of the Micro-Plate Loop Heat Pipe and development of the porous nickel capillary wick

• DOI: 10.1016/j.proeng.2017.10.031
• Publication Date: 2017-11-01T08:33:24Z
• Authors: Ziang Chen; Xinghua Tong; Hai Liu; Chunsheng Guo; Fangyi Qu; Huisheng Cong
• Keywords: Loop heat pipe; Micro-loop heat pipe

This paper designs and discusses a Micro-Plate Loop Heat Pipe which is suitable for the heat dissipation of various electronic chips, explains details loop pipe components. also discovers reliable sintering temperature thermal insulation time porous capillary wick made up nickel powder using method cold pressure forming with vacuum protection. It can lay solid foundation development efficient equipment. important circular further research development.