Effect of Sn grain orientation on formation of Cu6Sn5 intermetallic compounds during electromigration

• DOI: 10.1016/j.scriptamat.2016.09.028
• Publication Date: 2016-09-26T00:01:20Z
• Authors: Yu-An Shen; Chih Chen
• Keywords: Electromigration; Misorientation

Abstract The effects of Sn orientation and grain boundary misorientation on formation of Cu-Sn intermetallic compounds (IMCs) during electromigration were investigated. Significant anisotropic diffusion of Cu in Sn grains was observed. Interfacial Cu-Sn IMCs may grow rapidly, dissolve, or remain intact, depending on the angle of c-axis of Sn grains with the electron flow. In addition, grain boundaries did not play an important role in Cu diffusion because they are mostly cyclic twins.