Sustainable printed circuit board substrates based on flame-retarded PLA/flax composites to reduce environmental load of electronics: Quality, reliability, degradation and application tests
Lamination
Circuit reliability
Environmentally Friendly
DOI:
10.1016/j.susmat.2024.e00902
Publication Date:
2024-03-19T22:27:14Z
AUTHORS (13)
ABSTRACT
The present paper introduces a novel, sustainable approach to produce an eco-friendly Printed Circuit Board (PCB) substrate; substitute for traditional substrates, significantly reduce e-waste. We the prepreg technology, road actual circuit assembly with application studies, life cycle analysis (LCA), and sustainability analysis. flame-retarded prepregs resulting PCB assemblies were based on polylactic acid (PLA), structure is reinforced flax textiles. After copper lamination, subtractive production was performed, thermal mechanical reliability investigated in case of both laminated bare substrates. Steps surface roughness, peel followed. new set assemblies, post-assembly extended further shear strength soldered components mass regarding processes. evaluation showed that PLA/Flax substrates provide reliable structural performance up 200 °C reflow soldering process; this allows limited but stabilized possibilities specific lead-free solders. A basic blinker field programmable gate array (FPGA)--based design produced tested; latter has general complexity commercial circuit. vol% wt% our discussion reduction harmful waste range 90%, which disruptive significant result. Life (LCA) quantified ecological impact assembly, highlighting ease environmental load (∼10%) total assembly. Finally, qualitative degradation study introduced prepared samples investigate short-term stability mechanical-, colour-, mass- scanning electron microscopy (structure) Early results show boards can withstand harsh environment composting bin few days, time weeks, starts, pointing eventual decomposition. work directly connects multiple development goals.
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