Unraveling the Impact of Boron Nitride and Silicon Nitride Nanoparticles on Thermoplastic Polyurethane Fibers and Mats for Advanced Heat Management

• DOI: 10.1021/acsami.4c06417
• Publication Date: 2024-07-10T14:00:32Z
• Authors: Ahmadreza Moradi; Piotr K. Szewczyk; Aleksandra Roszko; Elzbieta Fornalik...; Urszula Stachewicz
• Keywords: Thermoplastic polyurethane; Electrospinning

The urgent challenges posed by the energy crisis, alongside heat dissipation of advanced electronics, have embarked on a rising demand for development highly thermally conductive polymer composites. Electrospun composite mats, known their flexibility, permeability, high concentration and orientational degree fillers, stand out as one prime candidates addressing this need. This study explores efficacy boron nitride (BN) its potential alternative, silicon (SiN) nanoparticles, in enhancing thermal performance electrospun thermoplastic polyurethane (TPU) fibers mats. 3D reconstructed models obtained from FIB-SEM imaging provided valuable insights into morphology fibers, aiding interpretation measured through scanning microscopy individual infrared thermography Notably, we found that TPU-SiN exhibit superior conduction compared to TPU-BN with up 6 °C higher surface temperature observed mats coated copper pipes. Our results underscore crucial role arrangement nanoparticles fiber improving Moreover, SiN are introduced more suitable filler enhancement TPU suggesting immense smart textiles management applications.