Vertically Aligned and Interconnected SiC Nanowire Networks Leading to Significantly Enhanced Thermal Conductivity of Polymer Composites

• DOI: 10.1021/acsami.8b00328
• Publication Date: 2018-02-28T13:16:56Z
• Authors: Yimin Yao; Xiaodong Zhu; Xiaoliang Zeng; Rong Sun; Jian-Bin Xu; Ching-Ping Wong
• Keywords: Microelectronics

Efficient heat removal via thermal management materials has become one of the most critical challenges in development modern microelectronic devices. However, previously reported polymer composites exhibit limited enhancement conductivity, even when highly loaded with thermally conductive fillers, because lack efficient transfer pathways. Herein, we report vertically aligned and interconnected SiC nanowire (SiCNW) networks as fillers for composites, achieving significantly enhanced conductivity. The SiCNW are produced by freeze-casting aqueous suspensions followed sintering to consolidate junctions, exhibiting a hierarchical architecture which honeycomb-like layers aligned. composite obtained infiltrating epoxy resin, at relatively low loading 2.17 vol %, represents high through-plane conductivity (1.67 W m-1 K-1) compared pure matrix, is equivalent significant 406.6% per 1 % loading. orderly network can act macroscopic expressway phonon transport believed be main contributor excellent performance. This strategy provides insights design high-performance potential used advanced materials.