Antioxidant high-conductivity copper paste for low-cost flexible printed electronics

• DOI: 10.1038/s41528-022-00151-1
• Publication Date: 2022-03-18T11:12:28Z
• Authors: Shuqing Hong; Chimin Liu; Shuqiang Hao; Wenxing Fu; Jian Peng; Binghui Wu; Nanfeng Zheng
• Keywords: Printed Electronics; Flexible Electronics; Screen printing

Abstract The flexible printed electronics (e.g., wearable devices, roll-up displays, heating circuits, radio frequency identification (RFID) tags) calls for high-conductivity and low-cost materials, particularly copper pastes. It is still a big challenge to develop reliable pastes both antioxidant films lines. In this work, an paste was achieved using microflakes with surface passivation by formate ions thiols, high conductivity of 13400 S cm −1 (the same order magnitude silver pastes, 1.8–2.5 × 10 4 ). universal applications as-prepared in electromagnetic interference (EMI) shielding films, anti-fog RFID via screen printing curing at 170 °C under ambient atmosphere were demonstrated. as-printed showed performance flexibility, stability, reliability. This work shows the great potential anti-oxidation commercial usage.