Fabrication and microwave characterisation of multilayer circuits for MMIC applications
Coplanar waveguide
Wideband
DOI:
10.1049/ip-map:19960228
Publication Date:
2002-07-26T11:08:59Z
AUTHORS (6)
ABSTRACT
A technique to fabricate novel multilayer monolithic microwave integrated circuit (MMIC) structures using polyimide as insulating dielectric layer is described. The formation, curing and dry etching processes are investigated in an attempt obtain high quality layers suitable for MMIC applications. By employing this technique, design routings become much easier conventional microstrip transmission lines lumped passive components can be realised with effective use of the substrate material. In paper it shown that a V-shaped coplanar waveguide (CPW) low characteristic impedance edge offset broadside directional couplers easily designed technique. This implementation avoid well known current crowding effects on conductor edges. Within Ku K band frequency range, circuits have been characterised show good performances. same miniaturisation lumped-distributed CPW ring-resonator bandpass filter achieved built-in shunt capacitors. Two poles two zeros could implemented by introducing discontinuities. measured results 3 dB bandwidth 3.7 GHz at 13.7 GHz.
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