Optical and Electronic Packaging Processes for Silicon Photonic Systems

• DOI: 10.1109/jlt.2015.2390675
• Publication Date: 2015-02-16T14:34:24Z
• Authors: Nicola Pavarelli; Jun Su Lee; Marc Rensing; Carmelo Scarcella; Shiyu Zhou; Peter Ossieur; Peter A. OBrien
• Keywords: Electronic Packaging

Fiber optic interconnection processes and hybrid integration of electronic devices for high speed Si photonic systems are presented. Thermal effects arising from these also investigated. An overview ePIXfab which offers affordable access to an advanced foundry service is This includes the presentation fundamental packaging design rules can greatly reduce time cost associated with development complex devices.