Microhomology-Dependent End Joining and Repair of Transposon-Induced DNA Hairpins by Host Factors in Saccharomyces cerevisiae

• DOI: 10.1128/mcb.24.3.1351-1364.2004
• Publication Date: 2004-01-16T22:43:12Z
• Authors: Jianhua Yu; Kelly Marshall; Miyuki Yamaguchi; James E. Haber; Clifford F. Weil
• Keywords: Non-homologous end joining; Transposase; Homology directed repair; Ku80; Rad50

The maize, cut-and-paste transposon Ac/Ds is mobile in Saccharomyces cerevisiae, and DNA sequences of repair products provide strong genetic evidence that hairpin intermediates form host during this transposition, similar to those formed for V(D)J coding joints vertebrates. Both strands must be broken excise, suggesting double-strand break (DSB) pathways should involved excision sites. In the absence homologous template, as expected, Ac excisions are repaired by nonhomologous end joining (NHEJ) can involve microhomologies close ends. However, unlike endonuclease-induced DSBs, presence template occurs gene conversion only about half time, remainder being NHEJ events. Analysis transposition mutant yeast suggests roles Mre11/Rad50 complex, SAE2, NEJ1, Ku complex Separation-of-function alleles MRE11 suggest its endonuclease function more important than either exonuclease or Rad50-binding properties. addition, interstrand cross-link PSO2 plays a role ends not seen linearized plasmids may positioning transposase cleavage at