Silicon Integrated Photonics Reliability

• DOI: 10.1364/iprsn.2017.iw3a.3
• Publication Date: 2017-07-17T12:35:58Z
• Authors: A. Mekis; G. Armijo; J. Balardeta; B. Chase; Y. Chi; A. Dahl; P. De Dobbelaere; Y. De Koninck; S. Denton; M. Eker; S. Fathpour; D. Foltz; S. Gloeckner; K.Y. Hon; S. Hovey; S. Jackson; W. Li; Y. Liang; M. Mack; G. Masini; G. McGee; S. Pang; M. Peterson; T. Pinguet; L. Planchon; K. Roberson; N. Rudnick; S. Sahni; J. Schramm; C. Sohn; K. Stechschulte; P. Sun; G. Vastola; S. Wang; G. Wong; K. Yokoyama; S. Yu.; R. Zhou
• Keywords: Transceiver; Component (thermodynamics)

We assess the reliability of a complete silicon integrated photonics platform through suite assurance and qualification tests. demonstrate high each component optical transceiver.