Review of Bumpless Build Cube (BBCube) Using Wafer-on-Wafer (WOW) and Chip-on-Wafer (COW) for Tera-Scale Three-Dimensional Integration (3DI)

• DOI: 10.3390/electronics11020236
• Publication Date: 2022-01-12T14:10:36Z
• Authors: Takayuki Ohba; Koji Sakui; Shinji Sugatani; Hiroyuki Ryoson; Norio Chujo
• Keywords: Three-dimensional integrated circuit

Bumpless Build Cube (BBCube) using Wafer-on-Wafer (WOW) and Chip-on-Wafer (COW) for Tera-Scale Three-Dimensional Integration (3DI) is discussed. interconnects between wafers chips are a second-generation alternative to the use of micro-bumps WOW COW technologies. technologies BBCube can be used homogeneous heterogeneous 3DI, respectively. Ultra-thinning down 4 μm offers advantage small form factor, not only in terms total volume 3D ICs, but also aspect ratio Through-Silicon-Vias (TSVs). interconnect technology increase number TSVs per chip due finer TSV pitch lower impedance bumpless interconnects. In addition, high-density with short length provide highest thermal dissipation from high-temperature devices such as CPUs GPUs. This paper describes process platform DRAMs high speed low IO buffer power by enhancing parallelism increasing yield vertically replaceable memory block architecture, presents comparison characteristics structures constructed BBCube.