Isothermal Oxidation Behavior of Nickel Base Single Crystal DD6 Film-Cooling Blades at 1050 °C

DOI: 10.3390/ma18071498 Publication Date: 2025-03-28T07:35:28Z
ABSTRACT
The isothermal oxidation behavior of single crystal DD6 film-cooling blades was investigated. The isothermal oxidation tests were conducted at 1050 °C, and the phase analysis was performed by XRD, while SEM (EDS) was employed to observe the material. In addition to experimental studies, a numerical simulation using three-dimensional finite element analysis based on Abaqus software (Version 6.13) was implemented to model the growth stress in specimens during the isothermal test. The obtained results showed that the average oxidation rate of specimens rose with increments in film hole spacing, up to a maximum value at a film hole spacing of 0.75 mm, and then fell, which could be interpreted with the concepts of the oxidation-affected zone and the growth stress. The results obtained from the numerical simulation of the growth stress agreed with the experimental results of the average oxidation rate. The oxide scale of film-cooling specimens mainly consisted of three layers, the NiO outer layer, the spinel sublayer containing cracks, and the non-continuous thin Al2O3 inner layer. The surface of the oxide scale commonly underwent spallation of the NiO outer layer, and the exposed sublayer could grow new NiO particles. The size of the NiO particles on the edge of the film holes was larger than those on the walls of the film holes. SEM images clearly showed that electro-hydraulic beam drilling on DD6 superalloy specimens could erode the γ phase in the γ/γ′ two-phase matrix, thereby inducing damages in regions near film holes.
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