Hybrid Photonic Integration on a Polymer Platform

• DOI: 10.3390/photonics2031005
• Publication Date: 2015-09-21T14:17:32Z
• Authors: Ziyang Zhang; David Felipe; Vasilis Katopodis; Panos Groumas; Christos Kouloume...; Hercules Avramopo...; Jean-Yves Dupuy; Agnieszka Konczyk...; Alberto Dede; Antonio Beretta; Antonello Vannucci; Giulio Cangini; Raluca Dinu; Detlef Schmidt; Martin Moehrle; Patrick Runge; Jung-Han Choi; Heinz-Gunter Bach; Norbert Grote; Norbert Keil; Martin Schell
• Keywords: Integration platform

To fulfill the functionality demands from fast developing optical networks, a hybrid integration approach allows for combining advantages of various material platforms. We have established polymer-based platform (polyboard), which provides flexible input/ouptut interfaces (I/Os) that allow robust coupling indium phosphide (InP)-based active components, passive insertion thin-film-based elements, and on-chip attachment fibers. This work reviews recent progress our polyboard platform. On fundamental level, multi-core waveguides polymer/silicon nitride heterogeneous been fabricated, broadening device design possibilities enabling 3D photonic integration. Furthermore, 40-channel line terminals compact, bi-directional network units developed as highly functional, low-cost devices wavelength division multiplexed network. larger scale, thermo-optic thin-film elements an InP gain chip integrated on to realize colorless, dual-polarization 90° frontend coherent receiver. For high-end applications, tunable 100Gbaud transmitter module has demonstrated, manifesting joint contribution technology, high speed polymer electro-optic modulator, driver electronics ceramic electronic interconnects.