Preparation and Curing Behaviour of N-Phenylmaleimide-Styrene-Maleic Anhydride Copolymer/<i>o</i>-Cresol Formaldehyde Epoxy Resin Composite System

• DOI: 10.4028/www.scientific.net/amr.646.30
• Publication Date: 2013-03-11T17:02:14Z
• Authors: Meng Yi Xu; Liang Zhou; Mei Juan Yin; Ai Qiong Kong
• Keywords: Thermal Stability; Maleic anhydride; Dissipation factor

Epoxy resin was used as the dielectric ink with some undesirable properties, such a high constant, dissipation factor and low thermal stability, In this paper, NSMA/OCFEP.system were prepared, properties curing behavior of NSMA/ OCFEP system intensively studied. Theoretical analysisi on process showed that when weight ratio is 2.0:1.0, best stability achieved.