Swelling Phenomena in Sintered Silver Die Attach Structures at High Temperatures: Reliability Problems and Solutions for an Operation above 350°C

• DOI: 10.4071/hitec-nheuck-ta14
• Publication Date: 2015-10-21T20:06:08Z
• Authors: N. Heuck; S. Müller; G. Palm; A. Bakin; A. Waag
• Keywords: Dilatometer

A very effective method to bond an electronic device a substrate is the pressure assisted sintering of sub-micron silver paste at temperatures between 150°C and 300°C. This technique-sometimes called “Silver-Sintering” or “Low Temperature Joining Technique (LTJT)” already used in many power electronics industry applications. It provides die attach layers with excellent pull-strength more than 100 MPa room temperature 30 Additionally electrical thermal conductivity nearly as good it pure silver. Such sintered are said be stable up above 500°C, but no detailed investigations this range available now. Our recent by shear- tests on monometallic chip/substrate-samples dilatometer measurements showed non-linear expansion structures 350°C including strong irreversible whole structure after long term heat treatments. Beyond swelling effect itself we present studies relationship layer resulting properties. Finally discuss possibilities take advantage out additionally analyze options reduce adding SiC-particles paste. As result, demonstrate that has taken into consideration when for operation 350°C.