Advanced 3D Packaging of Miniature Biomedical Sensors

• DOI: 10.4071/isom-2010-wp1-paper2
• Publication Date: 2015-10-21T20:04:06Z
• Authors: Dohyuk Ha; Tse-Yu Lin; Byung Guk Kim; Pedro P. Irazoqui; William J. Chappell
• Keywords: 03 medical and health sciences; 0302 clinical medicine

In this paper, a novel 3D packaging technique for miniature implantable wireless biomedical sensors intraocular pressure (IOP) sensing in mice is introduced. Due to the limited size of mouse eye, sensor and control integrated circuit (IC) very challenging. The overall packaged must be less than 12 mils cubed. order achieve desired thickness, magnetically aligned Z-axis anisotropic conductive adhesive (ACA) used create vertical interconnects micro-vias material distribute signals vertically limit eventual area device. first step demonstrate layer-to-layer interconnection between silicon IC liquid crystal polymer (LCP) layer using ACA. total thickness 6 mils. measured resistance through 1.15 ohms on average 3 mil × pads. second transitions 0.8 via holes LCP layer. A transition from an antenna rectifier above demonstrated. RF power received by loop bottom rectified generates 5 volts DC voltage. This enables extremely tight integration all sensor's components small form factor package, which can implanted into eyes monitoring pressure.