Wafer Map Image Analysis Methods in Semiconductor Manufacturing System

• DOI: 10.7232/jkiie.2015.41.3.267
• Publication Date: 2015-07-09T04:25:03Z
• Authors: Youngji Yoo; Daewoong An; Seung Hwan Park; Jun-Geol Baek
• Keywords: Semiconductor device fabrication; Wafer testing

In the semiconductor manufacturing post-FAB process, predicting a package test result accurately in wafer testing phase is key element to ensure competitiveness of companies. The prediction can reduce unnecessary inspection time and expense. However, an analysing method not sufficient analyze data collected at phase. Therefore, many companies have been using summary information such as mean, weighted sum variance, summarized reduces accuracy. paper, we propose analysis for Wafer Map Image process conduct experiment real data.