Amin Arbabian

ORCID: 0000-0001-7357-4759
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About
Contact & Profiles
Research Areas
  • Photoacoustic and Ultrasonic Imaging
  • Wireless Power Transfer Systems
  • Radio Frequency Integrated Circuit Design
  • Energy Harvesting in Wireless Networks
  • Wireless Body Area Networks
  • Microwave Engineering and Waveguides
  • Microwave Imaging and Scattering Analysis
  • Thermography and Photoacoustic Techniques
  • Photonic and Optical Devices
  • Ultrasound and Hyperthermia Applications
  • Neuroscience and Neural Engineering
  • Ultrasonics and Acoustic Wave Propagation
  • Ultrasound Imaging and Elastography
  • Advanced SAR Imaging Techniques
  • Acoustic Wave Resonator Technologies
  • Optical and Acousto-Optic Technologies
  • Advanced biosensing and bioanalysis techniques
  • Microwave and Dielectric Measurement Techniques
  • Analog and Mixed-Signal Circuit Design
  • Radar Systems and Signal Processing
  • Molecular Communication and Nanonetworks
  • Antenna Design and Analysis
  • Millimeter-Wave Propagation and Modeling
  • Indoor and Outdoor Localization Technologies
  • Advanced Sensor and Energy Harvesting Materials

Stanford University
2016-2025

Samford University
2019

University of Lisbon
2017

Ford Motor Company (United States)
2016

National Taiwan University
2014

University of California, Berkeley
2007-2011

This paper presents a low power 60 GHz transceiver that includes RF, LO, PLL and BB signal paths integrated into single chip. The has been fabricated in standard 90 nm CMOS process specially designed ESD protection on all mm-wave pads. With 1.2 V supply the chip consumes 170 mW while transmitting 10 dBm 138 receiving. Data transmission up to 5 Gb/s each of I Q channels measured, as data reception over 1 m wireless link at 4 QPSK with less than <sup...

10.1109/jssc.2009.2032584 article EN IEEE Journal of Solid-State Circuits 2009-12-01

A first proof-of-concept mm-sized implantable device using ultrasonic power transfer and a hybrid bi-directional data communication link is presented. Ultrasonic enables miniaturization of the implant operation deep inside body, while still achieving safe high levels (100 μW to few mWs) required for most applications. The current prototype measures 4 mm ×7.8 comprised piezoelectric receiver, an IC designed in 65 nm CMOS process off-chip antenna. can support maximum DC load 100 incident...

10.1109/jssc.2015.2427336 article EN IEEE Journal of Solid-State Circuits 2015-05-18

A wireless electrical stimulation implant for peripheral nerves, achieving >10× improvement over state of the art in depth/volume figure merit, is presented. The fully integrated measures just 2 mm × 3 6.5 (39 <sup xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">3</sup> , 78 mg), and operates at a large depth 10.5 cm tissue phantom. powered using ultrasound includes miniaturized piezoelectric receiver (piezo), an IC designed 180 nm HV BCD process,...

10.1109/tbcas.2018.2799623 article EN publisher-specific-oa IEEE Transactions on Biomedical Circuits and Systems 2018-03-13

High-resolution mm-wave array beamformers have applications in medical imaging, gesture recognition, and navigation. A scalable architecture for 3D imaging is proposed which single-element phase coherent transceiver (TRX) chips, with programmable TX pulse delay capability, are mounted on a common board to realize the array. This paper presents design of enabling TRX chip: highly integrated 94 GHz phase-coherent pulsed-radar on-chip antennas. The achieves 10 frequency tuning range 300 ps...

10.1109/jssc.2013.2239004 article EN IEEE Journal of Solid-State Circuits 2013-03-22

A high-precision implantable pressure sensor with ultrasonic power-up and data uplink is presented. The fully packaged implant measures 1.7 × 2.3 7.8 mm <sup xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">3</sup> includes a custom IC designed in 180-nm HV BCD process, transducer, an energy storage capacitor, single piezoelectric transducer (piezo). In order to reduce overall dimensions, unique circuit system design techniques are presented enable...

10.1109/jssc.2017.2782086 article EN publisher-specific-oa IEEE Journal of Solid-State Circuits 2018-01-04

A wireless-powered pad-less single-chip radio is implemented in 65 nm CMOS for applications Internet of Things (IoT) and wireless tagging. This fully-self-sufficient mm-wave has no pads or external components (e.g., power supply), the entire a single chip with dimensions 3.7 mm by 1.2 mm. To provide multi-access, to mitigate interference, it uses two separate bands RX/TX integrates both antennas measured communication range 50 cm. The transmitter modified Multipulse Pulse Position Modulation...

10.1109/jssc.2014.2384034 article EN IEEE Journal of Solid-State Circuits 2015-03-03

Two compact, low-loss, passive reflective type 60GHz phase shifters are presented in a standard 65nm CMOS technology. The designs use lumped-element baluns to implement the hybrid with an insertion loss better than 0.7dB. first architecture achieves 180 degrees shift average of 6.6dB and area 0.031mm <sup xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">2</sup> . second shifter demonstrates best reported 4.5dB 0.048mm while having ~150 shift. Both...

10.1109/cicc.2011.6055324 article EN 2022 IEEE Custom Integrated Circuits Conference (CICC) 2011-09-01

The next generation of implantable medical devices focuses on minimally invasive miniaturized solutions that operate reliably at large depths, provide duplex communication for closed-loop therapies, and enable multi-access a network implants to gather information or systemic interventions. Using ultrasound (US), power data can be efficiently transferred through the body as its wavelength MHz is comparable mm-sized receiver, resulting in improved focusing, coupling, acoustic-to-electrical...

10.1109/isscc.2017.7870460 article EN 2022 IEEE International Solid- State Circuits Conference (ISSCC) 2017-02-01

Low-cost, energy efficient, high-capacity, scalable, and easy-to-deploy point-to-point wireless links at mm-waves find a variety of applications including data intensive systems (e.g., centers), interactive kiosks, many emerging requiring pipelines. Operating above 100GHz enables compact low-footprint system solutions that can multiplex Tb/s aggregate rates for dense deployments; therefore competing with wired solution in aspects rate efficiency, but much more flexible deployment. The focus...

10.1109/isscc.2017.7870383 article EN 2022 IEEE International Solid- State Circuits Conference (ISSCC) 2017-02-01

In this paper, we propose a ball grid array (BGA) module with an integrated 3-D-printed plastic lens antenna for application in dedicated 130 GHz OOK transceiver that targets the area of 5G backhaul/fronthaul systems. The main design goal was full integration small footprint energy-efficient transceiver. system must be compact and cost effective while delivering approximately 30 dBi gain working band, defined as 120 to 140 GHz. Accordingly, 2 × aperture-coupled patch antennas designed 7...

10.1109/tap.2017.2755439 article EN IEEE Transactions on Antennas and Propagation 2017-09-21

We present an analytical framework for optimizing the efficiency of ultrasonic wireless power links implantable devices scaled down to sub-mm dimensions. Key design insights and tradeoffs are considered various parameters including operating frequency, transmission depth, size transmitter, impedance aperture miniaturized receiver, interface between receiver recovery chain on implant. The performance spherically focused transducers as transmitters is analyzed study limits tradeoffs. Two...

10.1109/tbcas.2018.2871470 article EN publisher-specific-oa IEEE Transactions on Biomedical Circuits and Systems 2018-09-20

High-resolution imaging and mapping of the ocean its floor has been limited to less than 5% global waters due technological barriers. Whereas sonar is primary contributor existing underwater imagery, water-based system in spatial coverage low throughput. On other hand, aerial synthetic aperture radar systems have provided high-resolution entire earth's landscapes but are incapable deep penetration into water. In this work, we present a proof-of-concept which bridges gap between...

10.1109/access.2020.3031808 article EN cc-by-nc-nd IEEE Access 2020-01-01

Miniaturized ultrasonic receivers are designed for efficient powering of implantable medical devices with reconfigurable power loads. Design parameters that affect the efficiency these under highly variable load conditions, including piezoelectric material, geometry, and operation frequency, investigated. Measurements were performed to characterize electrical impedance acoustic-to-electrical off-resonance operation. Finally, we propose, analyze, demonstrate adaptive matching frequency tuning...

10.1109/tuffc.2016.2606655 article EN publisher-specific-oa IEEE Transactions on Ultrasonics Ferroelectrics and Frequency Control 2016-09-07

This paper presents key design techniques and challenges in implementing one of the first integrated, energy-efficient 60 GHz transceivers including baseband circuitry. The 90 nm CMOS direct-conversion operates from a 1.2 V supply has been optimized for 5-to-10 Gb/s QPSK modulation centered at GHz. To achieve power consumption 170 mW transmit mode 138 receive mode, this leverages co-integration optimization mm-wave mixed-signal circuits.

10.1109/isscc.2009.4977434 article EN 2009-02-01

This paper presents the design and measurement of a distributed amplifier (DA) in standard 90-nm CMOS process. To improve gain bandwidth (BW) DA, use an elevated coplanar waveguide line also impedance tapering synthesized sections are proposed. The effects elevation shielding filaments on impedance, loss, effective dielectric constant transmission investigated accompanied by measurements. A methodology for DA is described that can take advantage multiple degrees freedom terms device size,...

10.1109/tmtt.2009.2014433 article EN IEEE Transactions on Microwave Theory and Techniques 2009-03-12

Implantable medical devices (IMDs) and the concept of integrating electronics with human body have been intriguing curiosities in medicine for many decades-slowly finding their way into mainstream several very specific conditions but not quite making it beyond "last resort" treatments. From reality today's cardiac pacemakers deep-brain stimulation to dream sensor motes roaming around one's bloodstream (as described by researchers writers like Isaac Asimov his adaptation Fantastic Voyage),...

10.1109/mmm.2016.2608638 article EN IEEE Microwave Magazine 2016-11-10

Coherent frequency-domain microwave-induced thermoacoustic (TA) imaging is investigated as an alternative to the traditional pulsed-based TA approaches that use extremely high-energy short excitation pulses, often produced by vacuum RF sources or spark-gap generators. It shown under peak-power limitation of source, dictated goals form factor and portability this paper, approach can achieve required signal-to-noise ratio (SNR) without sacrificing resolution other performance metrics....

10.1109/tmtt.2016.2637909 article EN IEEE Transactions on Microwave Theory and Techniques 2017-01-04

Millimeter-sized and low-cost sensor nodes can enable future applications of the Internet Things (IoT), for which number sensors is projected to grow a trillion within next decades. RF far-field power transfer potential technique wirelessly powering these since it offers flexible configuration networks, beamforming capability large range compared near-field approaches. However, system design needs be completely rethought this new paradigm IoT sensors. This paper, therefore, presents...

10.1109/tcsi.2015.2512720 article EN IEEE Transactions on Circuits and Systems I Regular Papers 2016-02-01

Intensity modulators are an essential component in optics for controlling free-space beams. Many applications require the intensity of a beam to be modulated at single frequency, including wide-field lock-in detection sensitive measurements, mode-locking lasers, and phase-shift time-of-flight imaging (LiDAR). Here, we report new type frequency modulator that refer as longitudinal piezoelectric resonant photoelastic modulator. The consists thin lithium niobate wafer coated with transparent...

10.1038/s41467-022-29204-9 article EN cc-by Nature Communications 2022-03-22

10.1109/icassp49660.2025.10888938 article EN ICASSP 2022 - 2022 IEEE International Conference on Acoustics, Speech and Signal Processing (ICASSP) 2025-03-12

10.1109/mmm.2025.3535137 article EN IEEE Microwave Magazine 2025-04-11

In the presented DA (distributed amplifier) architecture, a feedback mechanism that aims at improving gain with minimum reduction in BW is proposed. It seen band where distributed effect of action, ratio forward to reverse substantial (and depends on number stages used). The input and output blocks are connected this core stage provide matching stability This method different from other techniques improve (e.g., cascade DAs or matrix it uses new internal fed signals go through one twice....

10.1109/isscc.2008.4523124 article EN 2008-02-01

A three-stage cascaded distributed amplifier is designed in a 0.13μm SiGe BiCMOS process. By optimizing the both at architecture and element level, an extremely large measured gain-bandwidth product excess of 1.5THz obtained. The core consumes 75mA from 3.3V supply provides average gain 24dB 15GHz to least 110GHz (limited by equipment BW). RF-choke design employed provide bias current three stages. pass-band stays between 23 26.5dB.

10.1109/rfic.2012.6242266 article EN 2012-06-01

Imaging of subcutaneous vasculature is great interest for biometric security and point-of-care medicine. We investigate the feasibility microwave-induced thermoacoustic (TA) tomography as a safe, compact, low-power, cost-effective imaging technique by means application-specific design near-field, radio frequency (RF) applicators. Using commercial transducers, we demonstrate proof-of-concept TA synthetic phantoms, plant vasculature, earthworm blood vessels with only 50 W peak power, or 42 mW...

10.1109/tmtt.2017.2714664 article EN IEEE Transactions on Microwave Theory and Techniques 2017-06-30
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