A5064891903- Electron and X-Ray Spectroscopy Techniques
- Semiconductor materials and devices
- Primary Care and Health Outcomes
- Advancements in Photolithography Techniques
- Musculoskeletal pain and rehabilitation
- Healthcare professionals’ stress and burnout
- Patient Satisfaction in Healthcare
- Surface and Thin Film Phenomena
- Advanced Materials Characterization Techniques
- Posttraumatic Stress Disorder Research
- Health Policy Implementation Science
- Blood Pressure and Hypertension Studies
Iowa City VA Health Care System
2023-2025
MKS Instruments (United States)
1990
ABSTRACT Introduction The aim is to elucidate approaches care for comorbid chronic pain and PTSD (CP + PTSD) in the Veterans Administration (VA). These conditions are co-magnifying highly but traditionally treated separate clinical settings. Materials Methods This multimethod analysis examined CP via administrative data analyses qualitative interviews of VA-served veterans. Results All participants with diagnoses 2021 were identified using VA (N = 456,544). Visits during following year...
Field-emission vacuum microelectronic devices, which operate at a low voltage, require sharp emitters and minimal emitter to anode spacing. Using high resolution electron beam lithography in combination with metal lift-off, we have fabricated lateral multitip diodes spacings ranging from 0.03 0.5 μm. This is the smallest gap spacing of any structure reported literature. The devices were tested sample chamber our scanning microscope (SEM) has been adapted fixed probe tips associated...
Abstract Purpose Since the Choice Act in 2014, many Veterans have had greater options for seeking Veteran Affairs (VA)‐purchased care community. We investigated factors that influence rural Veterans’ decisions regarding where to seek care. Methods utilized semi‐structured telephone interviews query living or highly areas of Midwestern states about their health options, preferences, and experiences. Interviews were recorded transcribed, thematically coded, deductively analyzed using a...
SEM metrology is used to characterizecritical dimension (CD)controlandprocess bias in x-ray reticle fabrication. The pattern transfer between the single layer resist stencil and'the electroplated absorber investigated. This includes sidewall angle, accuracy of edge detection algorithm, and wet chemical etchants delineate absorberpattern. It a well known fact that geometry plays an importantrole producing final structure. Thispaperexplores theeffects ofresistprofilesand subsequentprocessing...