Trung-Hieu TRAN

ORCID: 0000-0002-8843-537X
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About
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Research Areas
  • Catalytic Processes in Materials Science
  • Advancements in Photolithography Techniques
  • Combustion and flame dynamics
  • Ultrasonics and Acoustic Wave Propagation
  • Molecular Junctions and Nanostructures
  • Nonlinear Optical Materials Studies
  • Rock Mechanics and Modeling
  • Electrodeposition and Electroless Coatings
  • Innovative concrete reinforcement materials
  • Nanofabrication and Lithography Techniques
  • Semiconductor materials and devices
  • Geophysical Methods and Applications
  • Structural Behavior of Reinforced Concrete
  • Structural Load-Bearing Analysis
  • Advanced Combustion Engine Technologies

University of Da Nang
2024

Hanoi Architectural University
2018-2019

University of Bern
2011

IBM Research - Almaden
2008

In UV cure nanoimprint lithography the interfaces as well resist composition play an important role in determining characteristics of resulting patterned material, which can be used for subsequent pattern transfer, or functional. It is applications that there only rare defects, and template release always a clean process. this paper fundamental physical chemical aspects interface are discussed, with particular focus on how they influence process removal.

10.2494/photopolymer.21.563 article EN Journal of Photopolymer Science and Technology 2008-01-01

Abstract Evaluation of behavior for beam-column connections in the buildings under cyclic loading is extremely important, where shear resistance one important factors. Beam-column are considered places which stresses concentrated during working process and it clearly showed exterior connections. There have been many published research experimental investigations external The use new concrete material (UHPSFRC) strengthening a idea has not much studied yet. Therefore, this paper presents...

10.1088/1742-6596/1425/1/012049 article EN Journal of Physics Conference Series 2019-12-01

The temporal instability of different types suppressor additives relevant for Damascene and 3D-TSV copper electroplating is studied by means potential transient experiments in combination with structure sensitive methods such as in-situ scanning tunneling microscopy synchrotron x-ray diffraction. molecular interplay various their specific antagonists at the copper/electrolyte interface discussed light successful fill sub-50nm features μm-sized 3D-TSVs.

10.1109/iitc.2011.5940319 article EN 2011-05-01

In cementitious materials, bonding at the contact surface between cement-paste and coarse aggregates plays an important role determines durability of material. Recent studies have evaluated impact strength on this by experiments different roughness concluded that area two components was weakest zone in concrete. This paper presents experiment test cobblestone to determine types damage modes using Acoustic Emission Technique. The result is shear stress occupies only about 10% total...

10.1051/matecconf/201818602005 article EN cc-by MATEC Web of Conferences 2018-01-01
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