A5065638332- Spectroscopy and Quantum Chemical Studies
- Advanced Chemical Physics Studies
- Molecular Junctions and Nanostructures
- Photochemistry and Electron Transfer Studies
- Molecular Spectroscopy and Structure
- Spectroscopy and Laser Applications
- Ion-surface interactions and analysis
- Molecular spectroscopy and chirality
- Nanoparticle-Based Drug Delivery
- Electronic Packaging and Soldering Technologies
- Antimicrobial agents and applications
- Selenium in Biological Systems
- Fluorine in Organic Chemistry
- Crystallography and molecular interactions
- Advanced biosensing and bioanalysis techniques
- Analytical Chemistry and Sensors
- Nonlinear Optical Materials Research
- RNA Interference and Gene Delivery
- Thermodynamic properties of mixtures
- Corrosion Behavior and Inhibition
- Astrophysics and Star Formation Studies
- Autophagy in Disease and Therapy
- Marine Biology and Environmental Chemistry
- Lipid Membrane Structure and Behavior
- Polymer Nanocomposite Synthesis and Irradiation
University of Michigan
2014-2022
Ann Arbor Center for Independent Living
2015-2017
University North
2017
Eastern Illinois University
2013-2014
Leibniz University Hannover
2000
Research on nanomedicines has rapidly progressed in the past few years. However, due to limited size of nuclear pores (9–12 nm), membrane remains a difficult barrier many nucleus-targeting agents. Here, we report development general platform effectively deliver chemical compounds such as drug molecules or nanomaterials into cell nuclei. This consists polyamine-containing polyhedral oligomeric silsesquioxane (POSS) unit, hydrophilic polyethylene glycol (PEG) chain, and photosensitizer rose...
ADVERTISEMENT RETURN TO ISSUEPREVReviewNEXTStudying Polymer Surfaces and Interfaces with Sum Frequency Generation Vibrational SpectroscopyXiaolin Lu*†, Chi Zhang‡, Nathan Ulrich‡, Minyu Xiao‡, Yong-Hao Ma†, Zhan Chen*‡View Author Information† State Key Laboratory of Bioelectronics, School Biological Science Medical Engineering, Southeast University, Nanjing 210096, Jiangsu Province, P. R. China‡ Department Chemistry, University Michigan, 930 North Avenue, Ann Arbor, Michigan 48109, United...
Adhesion is important in many industrial applications including those the microelectronics industry. Flip-chip assemblies commonly utilize epoxy underfills to promote reliability and buried interfacial structure of crucial device lifetime. Poor adhesion at this interface can cause premature failure. One method increase strength plasma treat substrate attached underfills, however, mechanism has not been thoroughly investigated molecular level situ, because it difficult probe a where occurs....
Novel photocurable ternary polymer networks were prepared by incorporating N-(4-hydroxy-3-methoxybenzyl)-acrylamide (HMBA) into a cross-linked thiol-ene network based on poly(ethylene glycol)diacrylate (PEGDA) and (mercaptopropyl)methylsiloxane homopolymers (MSHP). The materials displayed bactericidal activity against Escherichia coli Staphylococcus aureus reduced the attachment of marine organism Phaeodactylum tricornutum. Extensive soaking in aqueous solution indicated that no active...
Buried interfacial structures containing epoxy underfills are incredibly important in the microelectronics industry and their determine adhesion properties ultimately lifetime.
The benzene⋯acetylene dimer is a symmetric top with <italic>μ</italic> = 0.438(11) D and H⋯π 2.4921(1) Å.
Flux materials are ubiquitously utilized in the microelectronics industry during back-end processing. The Cu oxides or organic solderability preservatives present on posts used flip-chip packages must be removed by flux before solder reflow and die attachment to ensure a quality connection between substrate die. However, residues can cause bridging, which renders device useless. These studied situ at buried interface determine fundamental interactions how eliminated. In this paper, model...
Plasma treatment processing is a ubiquitous and necessary step in the manufacturing of electronic components. In semiconductor industry, this utilized to clean polymer substrates prior soldering applying epoxy underfill resins flip-chip technology. paper, two polymers, polystyrene polyimide, were protected with cover exposed various plasmas, simulate plasma steps found within microelectronics industry. The industrial that modeled when silicon die substrate are connected via solder bumps...
The rotational spectra for the normal isotopic species and six 13C singly substituted isotopologues (in natural abundance) of fluorobenzene⋯acetylene (C6H5F⋯HCCH) weakly bound dimer have been measured in 6.5–18.5 GHz region using chirped-pulse Fourier-transform microwave spectroscopy. HCCH molecule interacts with fluorobenzene via a CH⋯π contact is determined to lie almost over center of, approximately perpendicular to, aromatic ring, an H⋯π distance (perpendicular from H atom ring plane)...
The fast development of flip-chip (FC) devices has helped to keep ICs on pace for Moore's law. FC have many buried interfaces, the structures which all need be investigated in order optimize them. It is extremely difficult examine molecular interfaces samples with multiple layers due lack appropriate analytical tools. In this paper, real FC-on-leadframe devices, manufactured by Texas Instruments Incorporated, were using intrinsically interface-sensitive technique and sum-frequency generation...
Abstract In the micro-electronics industry, flux treatment on copper is an important procedure to ensure maximum adhesion copper. this research, sum frequency generation (SFG) vibrational spectroscopy has been applied investigate molecular behavior of molecules at buried and underfill (UF) interfaces in situ. SFG a second-order nonlinear optical spectroscopic technique, which can provide structural information surfaces with submonolayer interface specificity. Two model fluxes, adipic acid...
Separating adhesives from substrates is important for recycling metals and polymer materials used in a variety of applications such as food packaging electronics. A proof-of-concept self-assembled debonding layer on demand developed this research. The applied to silica surface three steps. These steps were characterized with sum frequency generation (SFG) vibrational spectroscopy, X-ray photoelectron spectroscopy (XPS), contact angle goniometry. SFG data shows characteristic signals each...