A5022350270- Particle Detector Development and Performance
- Radiation Detection and Scintillator Technologies
- Medical Imaging Techniques and Applications
- Advanced X-ray and CT Imaging
- CCD and CMOS Imaging Sensors
- Digital Radiography and Breast Imaging
- 3D IC and TSV technologies
- Radiation Effects in Electronics
- Advancements in Semiconductor Devices and Circuit Design
- X-ray Diffraction in Crystallography
- Semiconductor materials and devices
- Parallel Computing and Optimization Techniques
- Nuclear Physics and Applications
Centre National de la Recherche Scientifique
2010-2015
Aix-Marseille Université
2010-2015
Centre de physique des particules de Marseille
2010-2015
Lawrence Berkeley National Laboratory
2013
European Organization for Nuclear Research
2013
Heidelberg University
2013
Special Olympics
2013
Screen
2013
The radiation tolerance of 65 nm bulk CMOS devices was investigated using 10 keV X-rays up to a Total Ionizing Dose (TID) 1 Grad.Irradiation tests were performed at room temperature (25 • C) as well low (-15 C).The implications on the DC performance n and p channel transistors are presented.For small size devices, strong degradation is observed from dose 100 Mrad.Irradiations made Grad show complete drive loss in PMOS due decreasing transconductance.When irradiation conducted -15 C, less...
The high-voltage (HV-) CMOS pixel sensors offer several good properties: a fast charge collection by drift, the possibility to implement relatively complex in-pixel electronics and compatibility with commercial processes. sensor element is deep n-well diode in p-type substrate. contains electronics. main mechanism drift shallow, high field region, which leads radiation tolerance. We are currently evaluating use of detectors implemented 180 nm HV-CMOS technology for high-luminosity ATLAS...
One of the challenges all synchrotron facilities is to offer highest performance detectors for their specific experiments, in particular X-ray diffraction imaging and its high throughput data collection. In that context, DiffAbs beamline, Detectors Design Engineering groups at Synchrotron SOLEIL, collaboration with ImXPAD Cegitek companies, have developed an original unique detector a circular shape. This based on hybrid pixel photon-counting technology consists assembly 20 array (XPAD)...
The XPAD3 is the third generation of a single photon counting chip developed in collaboration by SOLEIL Synchrotron, Institut Néel and Centre de Physique Particules Marseille (CPPM). contains 9600 pixels 130 μm side electronic chain with an adjustable low level threshold each pixel. Imaging detection performance (detective quantum efficiency, modulation transfer function energy resolution) detectors hybridized Si CdTe sensors have been evaluated compared using monochromatic synchrotron...
Luminosity upgrades are discussed for the LHC (HL-LHC) which would make updates to detectors necessary, requiring in particular new, even more radiation-hard and granular, sensors inner detector region.
In order to extend its discovery potential, the Large Hadron Collider (LHC) will have a major upgrade (Phase II Upgrade) scheduled for 2022. The LHC after upgrade, called High-Luminosity (HL-LHC), operate at nominal leveled instantaneous luminosity of 5× 1034 cm−2 s−1, more than twice expected Phase I . new Inner Tracker needs cope with this extremely high luminosity. Therefore it requires higher granularity, reduced material budget and increased radiation hardness all components. A pixel...
We investigate the improvement from use of high-Z CdTe sensors for pre-clinical K-edge imaging with hybrid pixel detectors XPAD3. compare XPAD3 chips bump bonded to Si or in identical experimental conditions. Image performance narrow energy bin acquisitions and contrast-to-noise ratios images are presented compared. achieve signal-to-noise at least three times higher than within bins, thanks their much detection efficiency. Nevertheless provide better when working equivalent counting...
The XPAD3 chip bump-bonded to a Si sensor has been widely used in preclinical micro-computed tomography and synchrotron experiments. Although the is linear up 60 keV, performance of XPAD3/Si hybrid detector limited energies below 30 for which detection efficiencies remain above 20%. To overcome this limitation on efficiency order access imaging at higher energies, we decided develop camera based single chips high-Z CdTe sensors. We will first present construction new camera, from tests...
Vertex detectors for High Energy Physic experiments require pixel featuring high spatial resolution, very good signal to noise ratio and radiation hardness. A way face new challenges of the upgrades HL-LHC/ATLAS future hybrid vertex is use emerging 3D Integrated Technologies. However, commercial offers such technologies are only few designer's choice then much constrained. Moreover, as hardness in particular SEU tolerance configuration registers a crucial issue HL-LHC and, data on this point...
High-voltage particle detectors in commercial CMOS technologies, or HVMAPS, are a detector family that allows implementation of low-cost, thin and radiation-tolerant with high time resolution.Thanks to its radiation tolerance, the HV seen at CERN as promising alternative standard options.In order test concept, within ATLAS upgrade R&D, we currently exploring two concepts, bumpless hybrid pixel pixelated strip detector, both based on detectors.This paper describes detector.
XPAD3 is a large surface X-ray photon counting imager with high count rates, counter dynamics and very fast data readout. Data are readout in parallel by PCI Express interface using DMA transfer. The frame rate of the complete detector comprising 0.5 MPixels amounts to 500 images per second without dead-time.
XPAD3 is a large surface X-ray photon counting imager with high count rates, counter dynamics and very fast data readout. Data are readout in parallel by PCI Express interface using DMA transfer. The frame rate of the complete detector comprising 0.5 MPixels amounts to 500 images per second without dead-time.
To face new challenges brought by the upgrades of Large Hadron Collider at CERN and ATLAS pixels detector, for which high spatial resolution, very good signal to noise ratio radiation hardness is needed, 3D integrated technologies are investigated. In years come, will be upgraded Higher Luminosity (HL-LHC). The pixel detector needs handle this challenging environment. As a consequence, pursued with target offering higher unprecedented hardness. We present here test results first prototype...