A5101705471- Vehicle Noise and Vibration Control
- Adhesion, Friction, and Surface Interactions
- Acoustic Wave Phenomena Research
- 3D IC and TSV technologies
- Electronic Packaging and Soldering Technologies
- Semiconductor materials and devices
- Cerebrovascular and genetic disorders
- Soft Robotics and Applications
- Aluminum Alloy Microstructure Properties
- Structural Health Monitoring Techniques
- Aerodynamics and Acoustics in Jet Flows
- Modular Robots and Swarm Intelligence
- Copper Interconnects and Reliability
- Advanced Glycation End Products research
- Ultrasound in Clinical Applications
- Phosphodiesterase function and regulation
- Vehicle Dynamics and Control Systems
- Advanced Control Systems Design
- Subtitles and Audiovisual Media
- Neurological diseases and metabolism
- Stability and Control of Uncertain Systems
- Advanced Control Systems Optimization
- Pericarditis and Cardiac Tamponade
- Induction Heating and Inverter Technology
- Engine and Fuel Emissions
The University of Tokyo
2023-2024
Tokyo University of Agriculture and Technology
2024
Kogakuin University
2024
Osaka Prefecture University
2023
Kyoto Institute of Technology
2006-2023
Massachusetts General Hospital
2023
RIKEN Center for Integrative Medical Sciences
2023
LMU Klinikum
2023
Ludwig-Maximilians-Universität München
2023
Illinois Institute of Technology
2018-2023
To increase the yield of wafer-level Cu-Cu thermo-compression bonding method, certain surface pre-treatment methods for Cu are studied which can be exposed to atmosphere before bonding. inhibit re-oxidation under atmospheric conditions, reduced pure is treated by H2/Ar plasma, NH3 plasma and thiol solution, respectively, covered hydride, nitride a self-assembled monolayer (SAM) accordingly. A pair wafers then bonded evaluated tensile test. Results show that bond strengths SAM not sufficient...
Soft robots employ flexible and compliant materials to perform adaptive tasks navigate uncertain environments. However, soft are often unable achieve forces precision on the order of rigid-bodied robots. In this paper, we propose a new class mobile that can reversibly transition between stiff states without reconfiguration. The robot passively conform or actively control its shape, stiffen in current configuration function as robot, then return form. robotic structure consists passive...
The solidification structure of a hot-dip Zn-11%Al-3%Mg-0.2%Si coated steel sheet with slight Ti addition was investigated by EBSD. In every center the primary Al phase alloy-coating layer, TiAl3 observed scanning electron microscope, which suggests that acts as heterogeneous nucleation site phase. latter revealed to have perfect lattice coherency nucleus crystal orientation relationships between and are (001)TiAl3||(001)Al [100]TiAl3||[100]Al, (100)TiAl3||(001)Al [001]TiAl3||[100]Al,...
Operational transfer path analysis (OTPA) calculates contributions of reference points to response point vibration by using only operational data. Through OTPA, effective interior noise and reduction are achieved applying intensive countermeasure the high contributing part. However, it becomes difficult occasionally when many have similar a mode. In this case, obtaining mode considering how reduce become important information. study, we attempted calculate contribution modifying OTPA....
This paper introduces electrostatic and ultrasonic techniques to clean dust other contaminants from the surface of a gecko-like, microstrutured adhesive. The result is non-destructive, non-contact cleaning method that will afford robotic grippers, climbing robots, perching robots ability operate in real-world environments. Experimental results show efficiency for three different sizes glass beads, 53-75 μm, 75-90 90-106 ranges between 75-99% when using combination cleaning. far higher than...
<title>Abstract</title> <italic>HTRA1</italic> has emerged as a major risk gene for stroke and cerebral small vessel disease with both rare common variants contributing to risk. However, the precise mechanisms mediating this remain largely unknown does full spectrum of phenotypes associated genetic variation in general population. Using family-history informed approach, we first show that are linked ischemic 425,338 European individuals from UK Biobank replication 143,149 Japan. Integrating...
The removal of the permanent photoresist SU-8 by atomic hydrogen was studied using hot-wire reactors conventional open type and remote type. hot wire reactor has a separate glass chamber for decomposition via wire, can supply to substrate without significant radiation from wire. Therefore, density temperature be independently controlled. Using setup together with setup, authors demonstrated that presence in combination heating necessary completely remove SU-8. At below 150 °C, rate...
This paper describes the experimental evaluation of a robotic gripper's ability to perch on variety flat surfaces when used in conjunction with free-flying robot microgravity. The gripper is designed be integrated Astrobee, deployed International Space Station (ISS) April 2019. Astrobee was developed help astronauts perform routine tasks while aboard ISS. has physical space for payloads such as manipulator arm, which allows it grasp grapple points handrails conserve energy maintaining given...
A 6-bit high-speed and low-power pipelined binary-search ADC is presented. Over GHz conversion rate achieved by passive pipeline operation without amplifier. "Memory effect" caused charge sharing in the cancelled reset flatness of frequency response converter improved. Memory effect canceller also makes it easy to calibrate reference voltage each comparator enhance SNDR. The prototype fabricated 40nm-CMOS 29.21 dB SNDR with 1.6 GS/s at supply 0.9 V. a FoM 84.1 fJ/conv.step.
A novel surface activation technology for Cu-Cu bonding-based wafer-level vacuum packaging using hot-wire-generated atomic hydrogen treatment was developed. Vacuum sealing temperature at 300 °C achieved by pre-treatment Cu native oxide reduction, while 350 needed the conventional wet chemical reduction procedure. remote-type hot-wire tool employed to minimize substrate overheating thermal emission from hot-wire. The maximum during is lower than of nano-grain re-crystallization, which...
This article reports a wafer-level heterogeneous integration and vacuum packaging technology by thermocompression bonding using electroplated Cu sealing frame planarized single-point diamond fly-cutting. A high grain boundary density on the surface induced mechanical stress application during fly-cutting process enables with temperature as low 250°C. At such temperature, less amount of gases is desorbed, resulting in sealed cavity pressure lower than 100 Pa. Furthermore, shear strength...
In this paper, we investigate the variation in performance of variable speed induction motors fed by inverters with grades core materials used for stators and rotors from both results measurement finite element analysis. Identical shaped stator/rotor cores are manufactured using several kinds electrical steel sheets low to high grades. Then, characteristics these measured. Finite analysis is applied understand measured separating losses torques according origins. The motor found be good...
The solidification structure of a hot-dip Zn-11%Al-3%Mg-0.2%Si coated steel sheet with slight Ti addition was investigated by EBSD. In every center the primary Al phase alloy-coating layer, TiAl3 observed scanning electron microscope, which suggests that acts as heterogeneous nucleation site phase. latter revealed to have perfect lattice coherency nucleus crystal orientation relationships between and are {001}TiAl3//{001}Al <100>TiAl3//<001>Al, {100}TiAl3//{001}Al <001>TiAl3//<001>Al,...
This paper is concerned with a synthesis problem of multivariable PID controllers for class linear systems. First, mathematical model given. The closed-loop system described in the descriptor form and investigated comparing conventional ones. comparison reveals that proposed method loosens up constraints on signal dimensions, enables us to deal controller fixed structure. reduced static output feedback controller. Secondly, synthesized under H <sub...
Recently, infrared thermographs are used frequently by electronic engineers in the design phase of equipment. However, concerning temperature measurement a small-sized component, relation between minimum area detectable peak an object and corresponding to one pixel detector thermograph has not been known well. Therefore, such cases, there is possibility that large error would occur. In this study, simple method for estimating detection capability proposed discussed.