A5107140476- Welding Techniques and Residual Stresses
- Metal Forming Simulation Techniques
- Metallurgy and Material Forming
- Engineering Applied Research
- Additive Manufacturing and 3D Printing Technologies
- Metal and Thin Film Mechanics
- Additive Manufacturing Materials and Processes
- Advanced Welding Techniques Analysis
- Epoxy Resin Curing Processes
- Embedded Systems and FPGA Applications
- Microstructure and Mechanical Properties of Steels
- Laser and Thermal Forming Techniques
Universiti Teknologi MARA System
2023
Universiti Teknologi MARA
2015-2022
This research is devoted to numerical and experimental analysis on deformation of completely removed component induced by wire arc additive manufacturing (WAAM). The has the form a hollow rectangular thin wall made deposition layer stainless steel SS316L top substrate plate mild S235. In this research, thermomechanical finite element was applied with Goldak's double ellipsoid as heat-source model isotropic hardening rule based von-Mises yield criterion. A specialized simulation software...
Gathering data from previous research and incorporating it into a scientometrics investigation can provide valuable insights particular area of study. Wire Arc Additive Manufacturing (WAAM) is currently popular for producing customized metal products quickly. Despite this, there have been lack studies on implementing stress relief heat treatment after the manufacturing process to reduce residual in resulting parts potentially. This paper represents first bibliometric analysis study focusing...
Springback is the phenomenon in which material strip unbends itself after forming process. It caused by geometrical, mechanical properties or other process parameters. This paper focused on finite element simulation investigation effects of geometrical parameters springback amount High Strength Steel (HSS). Two parameters, punch radius ( Rp) and die opening W o ) were selected their effect studied. Finite U-bending test was performed using Simufact.forming TM with database (MatILDa) level...