A5053956320- Heat Transfer and Optimization
- Silicon Carbide Semiconductor Technologies
- Advanced Multi-Objective Optimization Algorithms
- Topology Optimization in Engineering
- Thermal properties of materials
- Thermal Radiation and Cooling Technologies
- Refrigeration and Air Conditioning Technologies
- Heat Transfer and Boiling Studies
- Electric Motor Design and Analysis
- Induction Heating and Inverter Technology
- Advanced DC-DC Converters
- Multilevel Inverters and Converters
- Advanced Aircraft Design and Technologies
- Magnetic Properties and Applications
- Heat Transfer Mechanisms
- Radiation Effects in Electronics
University of Illinois Urbana-Champaign
2021-2024
This article demonstrates the use of topology optimization (TO) to generate optimal fin designs capable high heat flux removal without increasing pumping power. We pseudo-3D modeling validated against 3D simulations for thermal-hydraulic performance, which reduces computational intensity and allows a wider range be considered. The accuracy is aided by allowing transfer coefficient vary locally with flow conditions, in contrast other studies that often assume constant independent surface...
This article presents the design and demonstration of an all silicon carbide (SiC) 2×250 kW dual inverter for heavy-duty traction applications. Through use a formal electrothermal-control co-design approach, maximum power density proposed system is 60 kW/L, which accomplished by. More specifically, to analyze thermal performance inverter, lumped model developed based on characteristics modules cold plate. To complicated interaction between losses module junction temperatures, closed-loop...
The United States Department of Energy targets an 88 % reduction in motor and power electronics volume by the year 2025 while minimizing or eliminating magnet usage. Induction machines are a magnet-free alternative with advantages such as low cost, high reliability, capability withstanding short-term overload. To meet these societal goals, we develop induction machine that uses electro-thermal co-designed converter-integrated thermal management approach. utilizes toroidal windings stator,...
Abstract The recent growth in electronics power density has created a significant need for effective thermal management solutions. Liquid-cooled heat sinks or cold plates are typically used to achieve high volumetric cooling. A natural tradeoff exists between the and hydraulic performance of plate, creating an opportunity design optimization. Current optimization methods rely on computationally expensive time consuming computational fluid dynamics (CFD) simulations. Here, we develop rapid...
Abstract High power electronics are a key component in the electrification of aircraft. Large amounts need to be handled onboard generate sufficient lift for flight. The transient nature aircraft's mission profile produces varied loading and environmental influences, making consistent cooling device reliability difficult maintain. Due limitations weight performance metrics, thermal management capability becomes inhibiting factor preventing adoption all electric Many efforts focused on...
Advances in wide bandgap (WBG) semiconductor technologies have enabled the development of highly-compact multi-chip power modules for various applications. Direct cooling approaches, where coolant circulates and directly contacts module base plate, demonstrated ability to reduce junction-to-coolant thermal resistance more than 10% by eliminating interface materials. This study focuses on design methodology plate fins enable high performance direct modules. A two- dimensional two-layer...
Single phase liquid cooled heat sinks are a preferred for thermal management in many power dense electronics cooling applications. This paper shows how an additively manufactured (AM) polymer manifold coupled with direct approach can provide high performance electronic converters. We experimentally demonstrate 50% reduction mass of the converter subsystem using our manifolds while maintaining comparable junction-to-coolant resistance ( [[EQUATION]] 0.3 K/W) to state-of-the-art (SOA) metal...