A5021587307- Tunneling and Rock Mechanics
- Drilling and Well Engineering
- Advanced materials and composites
- 3D IC and TSV technologies
- Photonic and Optical Devices
- Microstructure and mechanical properties
- Electronic Packaging and Soldering Technologies
- Aluminum Alloy Microstructure Properties
- Industrial Technology and Control Systems
- Advanced Sensor and Control Systems
- Plasmonic and Surface Plasmon Research
- High Temperature Alloys and Creep
- Hearing Loss and Rehabilitation
- Advanced Algorithms and Applications
- Hearing, Cochlea, Tinnitus, Genetics
- Hydrogen embrittlement and corrosion behaviors in metals
- Advanced Materials Characterization Techniques
- Aluminum Alloys Composites Properties
- Advanced machining processes and optimization
- Optical Coatings and Gratings
- Microstructure and Mechanical Properties of Steels
- Semiconductor Lasers and Optical Devices
- Photonic Crystals and Applications
- Advanced Welding Techniques Analysis
- High Entropy Alloys Studies
Applied Materials (Singapore)
2023-2024
University of Sheffield
2024
University of Science and Technology Beijing
2018-2023
Max-Planck-Institut für Nachhaltige Materialien
2021-2023
University of South China
2023
Imperial College London
2021
Central South University
2009-2019
Shaoyang University
2015
École Polytechnique Fédérale de Lausanne
2010-2014
National University of Defense Technology
2012
A computational model was developed to simulate the responses of auditory-nerve (AN) fibers in cat. The model’s signal path consisted a time-varying bandpass filter; bandwidth and gain were controlled by nonlinear feed-forward control path. This produced realistic response features several stimuli, including pure tones, two-tone combinations, wideband noise, clicks. Instantaneous frequency glides reverse-correlation (revcor) function broadband noise achieved carefully restricting locations...
Abstract Defects in acceptor-doped perovskite piezoelectric materials have a significant impact on their electrical properties. Herein, the defect mediated evolution of and ferroelectric properties Fe-doped (Pb,Sr)(Zr,Ti)O 3 (PSZT-Fe) piezoceramics with different treatments, including quenching, aging, de-aging, poling, was investigated systematically. Oxygen vacancies cubic symmetry are preserved quenched PSZT-Fe ceramics, rendering them robust behaviors. In aged polycrystals, dipole...
Soldering technology for optoelectronic packaging is reviewed by studying modules in four categories: solder assembly with no precision self-alignments, and self-aligned no, one or two mechanical stops. There have been at least 60 papers 8 U.S. patents published between 1990 1995. In addition to die-attachments, soldering has successfully demonstrated alignments. However, some issues may hamper the progress of its manufacturing insertion wide applications. Four be discussed are materials,...
Residual stress distribution induced by multistep fabrication processes is of great significance in reliable design critical engineering components, such as powder metallurgy Ni-based superalloy turbine discs. By using neutron diffraction and 2D-detector X-ray diffraction, the through-thickness residual was determined fabricated discs via isothermal forging, solution treatment aging treatment. The experimental results demonstrated that exhibited typical thermal while plastic...
Flip-chip assembly is an important technology for first level electronic packaging. Among different approaches, thermosonic bonding becoming attractive choice because it cost-effective. To increase the capability high input/output (I/O) assembly, a novel longitudinal system was developed in this study. This has two advantages over transverse system: overcomes planarity problem and simplifies tool configuration. During development, end-effector designed with rigorous considerations of...
The microstructure and localized corrosion behavior of the 7050‐T6 Al alloys treated with different quench transfer time were investigated. Optical microscope observations show that volume fraction recrystallized grains increases slightly prolonging time. Scanning electron reveal stable η (MgZn 2 ) phase nucleates precipitates on grain boundaries in process transferring to quench. Further observations, using transmission microscope, found size, nearest neighbor distance, copper content...
Thermosonic flip-chip bonding is a wire technology modified for assembly. Compared with the soldering technology, it simpler, faster and more cost-effective. Unfortunately, yield of thermosonic low unreliable because difficult to control ultrasonic energy transmission. A small planarity angle between tool stage can result in nonuniform distribution. self-planarization concept was proposed solve this problem. layer polymer placed chip smooth nonplanar contact. Experimental measurements finite...
The anomalous amplitude-dependent internal friction peak (P1) previously observed in cold-worked and partially annealed dilute AlMg alloys around room temperature are systematically studied with polycrystalline Al–0.12 wt% Mg single crystal Al–0.02 specimens inverted torsion pendulums. This is found to be consisting of two separate peaks (P1′ P1′). amplitude associated the lower P1′ shifts toward amplitudes that higher an increase measurement. modulus curve corresponding changes normally...