A5086373058- Photonic and Optical Devices
- Advanced Fiber Laser Technologies
- Mechanical and Optical Resonators
- Thin-Film Transistor Technologies
- Advanced Fiber Optic Sensors
- Heat Transfer and Boiling Studies
- Photonic Crystals and Applications
- Heat Transfer and Optimization
- Nanofabrication and Lithography Techniques
- Silicon Carbide Semiconductor Technologies
- Analytical Chemistry and Sensors
- GaN-based semiconductor devices and materials
Hong Kong Polytechnic University
2023-2024
Xiamen University
2022
Gallium nitride high electron mobility transistor (GaN HEMT) devices have become critical components in the manufacturing of high-performance radio frequency (RF) or power electronic modules due to their superior characteristics, such as saturation speeds and densities. However, heat characteristics GaN HEMTs make device level cooling a problem solve since performance degradation even failure may occur under temperatures. In this paper, we proposed 2.5D integration method with device-level...
A 3D micro-printed Limacon-shaped whispering-gallery-mode (WGM) microcavity is presented. It can achieve both high Q value and directional emission thus promising for on-chip cavity-enhanced fluorescence spectroscopic sensing applications.
An optical 3D micro-printing method is presented to directly print polymer whispering-gallery mode (WGM) microlaser with deformed microcavity. It can rapidly and precisely tailor the geometry of WMG microcavities for on-chip integrated sensing applications.
This paper proposes a Si heat sink based jetting staggered microchannel for large area high-performance CPU chip module, which has the advantages of good surface temperature uniformity, high dissipation efficiency and easiness assembling. The is manufactured using DRIE silicon-silicon bonding processes. thermal characteristics assembled samples are studied. simulation experiment results show an improvement by combining straight microchannels. optimal flow rate combination horizontal fluids...